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INNOVACERA® 6″ 8″ Aluminum Nitride ( AlN) Wafer Substrates

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Description

Aluminum Nitride Wafer Substrates play an essential role in the semiconductor industry. One of the key reasons for their popularity is their thermal profile, which closely matches that of silicon. This similarity makes AIN substrates an excellent choice for semiconductor applications where thermal management is critical. Innovacera, a leading provider of these substrates,offers Aluminum Nitride Wafer Substrates in various diameters, ranging from 2 inches to 8 inches, with the 6-inch and 8-inch sizes being the most commonly used.

Aluminum Nitride Features Include:
>High Thermal Conductivity
>High Electrical Insulation
>Low Dielectric Constant
>Mechanical Strength and Stability
>Corrosion Resistance
Chemical and Thermal Stability
The unique properties of Aluminum Nitride Wafer Substrates make them highly sought after in various semiconductor applications.

The substrates are particularly valued in:
>Power Electronics
>RF and Microwave Devices
>LED Manufacturing
>Wafer Bonding Technology

 

AlN Wafers Specification:

Properties Unit 6″ Wafer 8″ Wafer
Material AlN Ceramics AlN Ceramics
Thermal Conductivity W/m·K >170 >170
Thermal Expansion Coefficient ppm/K(300~1200K) 4-6 4-6
Sintering Aid Y2O3 Y2O3
Diameter mm 150+/-0.25 200+/-0.25
Notch Depth mm 1.0+0.25/-0/Locating Edge 1.0+0.25/-0
Notch Angle 90°+5/-2° 90°+5/-2°
Thickness μm 400±15 400±15
TTV μm <10 <10
BOW μm <±30 <±30
Warp μm <50 <50
Ra nm <50 <50

Additional information

Size

6", 8"

Dimension

OD150*0.635mm, OD150*0.125mm, OD200*0.725mm, OD200*0.125mm

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